A numerical study on mixed convection of water-based CuO nanofluids in a lid-driven square enclosure: Effects of viscosity models

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Tarih

2016

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Yayıncı

Avestia Publishing

Erişim Hakkı

info:eu-repo/semantics/openAccess

Özet

Effects of various viscosity models on mixed convection of water-based CuO nanofluids in a lid-driven square enclosure with a constant heat flux heater were investigated numerically in this study. The computational results were obtained for the heater length of 0.50. The Grashof number was kept at a constant value of 104, and the Reynolds number was varied so that the Richardson number takes values in the range of 0.1 to 10. Three different nanoparticle volume fraction were taken: 0%, 5% and 10%. Results show that a little increase in circulation intensity for forced convection dominant flow regime and a decrease for natural convection dominant regime are seen when Pak and Cho viscosity model is used instead of Einstein viscosity model as a result of increase in viscosity. Results also show that the centre of circulation moves upward when the Pak and Cho viscosity model is used instead of Einstein viscosity model. Finally, Results show that the Einstein model gives the highest average Nusselt number while the Pak and Cho yields the lowest average Nusselt number. Differences in the average Nusselt numbers of Einstein, Brinkman and Batchlor models are in insignificant levels. Percentage difference in the average Nusselt numbers of Pak and Cho model and other models increases with an increase in solid volume fraction except for the Maiga model. Percentage difference between the average Nusselt numbers of Pak and Cho model and Maiga model shows a decrease with the solid volume fraction. © Avestia Publishing, 2017.

Açıklama

Proceedings of the 2nd World Congress on Mechanical, Chemical, and Material Engineering, MCM 2016 -- 22 August 2016 through 23 August 2016 -- -- 139568

Anahtar Kelimeler

Heat Source; Mixed Convection; Nanofluid; Square Enclosure; Viscosity Model

Kaynak

Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering

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N/A

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0

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