Drying Simulation of Pumpkin Seed

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dc.authorscopusid54782136400
dc.authorscopusid57194230895
dc.authorscopusid6602300270
dc.authorscopusid12139419100
dc.authorscopusid24071168200
dc.contributor.authorAkyol E.
dc.contributor.authorSusantez Ç.
dc.contributor.authorKahveci K.
dc.contributor.authorHacıhafızoğlu O.
dc.contributor.authorKaya Y.
dc.date.accessioned2024-06-12T10:29:19Z
dc.date.available2024-06-12T10:29:19Z
dc.date.issued2015
dc.descriptionWorld Congress on Mechanical, Chemical, and Material Engineering, MCM 2015 -- 20 July 2015 through 21 July 2015 -- -- 288819en_US
dc.description.abstractIn this study, moisture distribution of coarse type pumpkin seed in the form of spheroid is modelled by using diffusion equation. The analysis made for natural sun drying for constant environment temperature. Simulation results were obtained by Comsol Multiphysics finite element analysis software for 0.5, 1, 2, 5, 10, 15, 20, 25, 30 and 34 hours respectively. On the other hand, average moisture content as a function of time is obtained and an exponential decay type cure with three parameters is fitted to these results. The results show that drying rate of pumpkin seed is falling with time. Simulations shows a good agreement with experimental results at the literature. © 2015, Avestia Publishing. All rights reserved.en_US
dc.identifier.isbn9.78193E+12
dc.identifier.issn2369-8136
dc.identifier.scopus2-s2.0-85146721002en_US
dc.identifier.scopusqualityN/Aen_US
dc.identifier.urihttps://hdl.handle.net/20.500.14551/17693
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherAvestia Publishingen_US
dc.relation.ispartofProceedings of the World Congress on Mechanical, Chemical, and Material Engineeringen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectDiffusion; Drying; Pumpkin Seeden_US
dc.titleDrying Simulation of Pumpkin Seeden_US
dc.typeConference Objecten_US

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