Slip Flow of Nanofluids between Parallel Plates Heated with a Constant Heat Flux

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dc.authoridÖZTÜRK, Ayşegül/0000-0002-6297-2767
dc.authoridKahveci, Kamil/0000-0003-2492-8690
dc.authorwosidÖZTÜRK, Ayşegül/ABC-6885-2020
dc.authorwosidKahveci, Kamil/A-2954-2016
dc.contributor.authorOzturk, Aysegul
dc.contributor.authorKahveci, Kamil
dc.date.accessioned2024-06-12T11:14:14Z
dc.date.available2024-06-12T11:14:14Z
dc.date.issued2016
dc.departmentTrakya Üniversitesien_US
dc.description.abstractThis study investigates the steady fully developed laminar flow and heat transfer of nanofluids between parallel plates heated with a constant heat flux. The governing equations were solved analytically under the boundary conditions of slip velocity and temperature jump. Water was taken as the base fluid and Cu, CuO and Al2O3 as the nanoparticles. The results were obtained for the slip factor in the range of 0 to 0.04, for the Brinkman number in the range of -0.1 to 0.1, for three different values of the ratio of the liquid layering thickness to the particle radius (0.1, 0.2, and 0.4) and for the solid volume fraction ranging from 0 % to 8 %. The results show that the nanoparticle presence in the base fluid has a significant effect on both the velocity field and heat-transfer characteristics. The average Nusselt number increases considerably with the increase of the nanoparticle solid volume fraction. The average Nusselt number takes much higher values for high values of the ratio of the liquid layering thickness to the nanoparticle radius. The average heat transfer rate of nanofluids between parallel plates ranges from the highest to the lowest when Cu, Al2O3, and CuO are used as nanoparticles, respectively.en_US
dc.identifier.doi10.5545/sv-jme.2016.3188
dc.identifier.endpage520en_US
dc.identifier.issn0039-2480
dc.identifier.issue9en_US
dc.identifier.scopus2-s2.0-84982985641en_US
dc.identifier.scopusqualityQ3en_US
dc.identifier.startpage511en_US
dc.identifier.urihttps://doi.org/10.5545/sv-jme.2016.3188
dc.identifier.urihttps://hdl.handle.net/20.500.14551/23861
dc.identifier.volume62en_US
dc.identifier.wosWOS:000383345700004en_US
dc.identifier.wosqualityQ4en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherAssoc Mechanical Engineers Technicians Sloveniaen_US
dc.relation.ispartofStrojniski Vestnik-Journal Of Mechanical Engineeringen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectSlip Flowen_US
dc.subjectNanofluiden_US
dc.subjectParallel Plateen_US
dc.subjectSlip Factoren_US
dc.subjectNusselt Numberen_US
dc.subjectLiquid Slipen_US
dc.subjectLaminar Nanofluiden_US
dc.subjectMicrochannelen_US
dc.subjectConvectionen_US
dc.titleSlip Flow of Nanofluids between Parallel Plates Heated with a Constant Heat Fluxen_US
dc.typeArticleen_US

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